- Formats from 1/2 to 1/6 cells and sizes up to M12
- Free-form cutting
- Power increase of up to 2W through TLS technology
3D-Micromac's patented laser technology for direct cutting of solar cells is the leading method for cutting cells.
When conventional cutting methods reach their limits, TLS technology with ultra-short pulses comes into play. Excellent cutting qualities with high reproducibility and accuracy can be guaranteed. Whether half-cell, third-cell, quarter-cell or the trend-setting six-cell.
The great flexibility of TLS technology makes it possible to provide our customers with comprehensive support. Adaptation in the number of cell cuts, variation in the size of the substrates up to 220mm or a high flexibility in the freedom of shape. From silicon-based cell types such as PERC, TOPCon, HJT to IBC, the processing of your mono- and polychristaline photovoltaic cells is possible.
Das für die Schweißproduktion entwickelte Welding 4.0-Qualitätsmanagement-System ewm Xnet unter-stützt wirksam alle am Schweißprozess beteiligten Mitarbeiter (Schweißaufsichtspersonen, Schweißer, Produktionsleiter, Manager, etc.). Das Leistungsspektrum von ewm Xnet bietet einerseits das Monitoring und die Dokumentation sämtlicher Schweißparameter beliebig vieler, vernetzter Schweißgeräte. Anderer-seits bietet es eine digitale Erstellung und Verwaltung der Schweißdokumentation (WPQR, WPS, Schwei-ßerzertifikate) und eröffnet zahlreiche Auswertungsmöglichkeiten. Zusätzlich kann das Xnet Schweißma-nagement-System die Verwaltung von Bauteilen inklusive aller damit verbunden Informationen, wie Bau-teilidentifizierung über Barcode, Materialverbrauch, Schweißparameter, etc, übernehmen. Durch den modularen Aufbau kann das Xnet Schweißmanagementsystem in kleinen, mittleren und großen Unter-nehmen eingesetzt werden.
3DMicromac‘s microSHAPE™ laser system is designed for the processing of large and flat substrates with high accuracy. The highly versatile system allows the combination of different laser processes in a single machine. In addition, it is capable of processing with multiple working heads – this parallel processing makes higher throughputs achievable.
microSHAPE™ is an industry proven solution for all kinds of ablative and non-ablative processes. These include cutting, selective removal of thin films, and structuring processes like engraving and marking. The microSHAPE™ system is suitable for machining a variety of materials, e.g. glass, metals, polymer, ceramics, display stacks, and coated substrates.
Free form cutting with extraordinary quality
Damage free cutting edges
Contactless processing enables minimal cost of ownership
Cutting speed up to 1.5 m/sec
Laser sources according to customer requirements
Up to 3 independent beam paths
Applications:
- Laser cutting, dicing, and filamentation
- Laser drilling – available as trepanning or percussion process
- Laser micro structuring and ablation, e.g. with FSLA technology
- Laser micro engraving, both on the substrate surface and as sub surface
engraving in transparent materials
Laser-Lift-Off (LLO) using DPSS laser and scanner systems
Materials: ceramics, metals, polymers, glass materials, semiconductors, compound material
The 7-axis arc welding robot B4LS from the FD series is compact and, thanks to the integrated cable routing, offers optimal protection during the work process. The extended degree of freedom enables a constant torch orientation when immersing in tight work spaces. In addition, the FD-B4LS offers an extended arm compared to the FD-B4S and thus a larger working radius.
Due to the high flexibility, several robots can be positioned closer to each other, so it is possible to have a larger number of robots in the cell or system working together.
The most important technical data at a glance:
Number of axes: 7
Working Range (P-point): R 2008 mm
Max. payload: 4 kg
Positional repeatability: +/- 0.08 mm
Drive system: AC servo motor
Drive power: 5650 W
Weight: 321 kg
Type:articulated
Number of axes:7 - axis
Functions:purpose, arc welding, handling
Other characteristics:High speed, high precision, self-learning, flexibility, extended arm
Drive System:AC Servo Motor
Payload:4 kg
Weight:321 kg
CLEAN TUBE is used as soon as hygiene plays an important role. CLEAN TUBE'S innovative technology has a antibacterial effect and has reduces the groth of bacteria by more than 99,9%
Particularly practical: The antibacterial effect is directly integrated into the tube. Of course, clean tube is completely safe for your health and provides reliable protection and safety over at least 10 years.
Diameter (mm):110 / 160
Radius:650 / 800
Material:PVC (silver ions in the pipe matrix)
Colour:same iron grey, silver grey
Special fabrication:on request
Die Gasgekühlten PM MIG/MAG-Schweißbrenner sind optional als Funktionsbrenner mit hochwertigem OLED-Grafikdisplay ausgestattet.
Verfügbar als PM 221 bis 250A, PM 301 bis 330A und PM 401 bis 450A
— Sicherer Halt dank Gummieinsätzen in der Griffschale
Highlights Funktionsbrenner:
— Automatische LED-Beleuchtung beim Bewegen des Brenners
— Anzeigen und Einstellen direkt vom Arbeitsplatz
— Schweißstrom und Drahtgeschwindigkeit
— Spannungskorrektur
— Programm- und JOB-Anwahl
— Schweißprozessumschaltung
— Störungen und Fehlermeldungen
— Brennerbetriebsmodus (2-Takt/4-Takt)
— Drossel
— Schweißprozess (Standard, Impuls, coldArc, rootArc, forceArc)
Unterstützt außerdem die Xnet Schweißmanagementsoftware:
— Anwahl der Schweißaufgabe nach Schweißfolgeplan
— Bauteilverwaltung
The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength.
Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.
The microMARK™ MCF is a premium engraving system. Using an UV excimer laser results in a superior engraving quality considering all cosmetic aspects – without any heat affection and micro cracks. The system is suitable for marking of all kinds of materials and coatings including highindex, tinted, and coated lenses. The microMARK™ MCF is the right choice for concave or convex as well as for blocked and unblocked lenses. The industryapproved system guarantees maximum throughput and availability.
Premiumquality excimer laser marking
Technical engraving and branding on all kinds of lenses and coatings
UDI marking of hard and soft contact lenses
Maximum throughput by automatic handling
Superior availability by second laser source
3DMicromac‘s microSTRUCT™ C is a highly flexible laser micromachining system predominantly used in product development and applied research. Superior flexibility makes the system ideally suited for laser structuring, cutting, drilling and welding applications on a variety of substrates, e.g. metals, alloys, transparent and biological material, ceramics and thin film compound systems. The microSTRUCT™ C offers a maximal degree of freedom regarding the positioning of the substrates.
Flexible, stable and repeatable machining results
Two independent and free configurable working areas with various optical setups
Open system concept for the integration of different laser sources
High range of software functions (Masterscript)
User friendly, flexible, upgradeable system
Hochwertiger Aluminiumschweißzusatzwerkstoff S Al 5087 - AlMg4,5MnZr
Abmessungsbereich 0,90 bis 1,60 mm MIG-Drähte / 1,60 - 4,00 mm WIG-Stäbe
Spulen mit bis zu 40 kg Füllgewicht, Fässer mit bis zu 140 kg Füllgewicht
Zulassungen: ABS, BV, DNV GL, LR, TÜV, DB