Termékek vásároljon hegesztő gázt közelben (52)

3DMicromac‘s microCELL™ TLS is a highly productive laser system for separation of standard silicon solar cells into half cells. The microCELL™ TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells. The ablation free process guarantees an outstanding edge quality. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the full scale manufacturing of crystalline half cells. The microCELL™ TLS system offers half cell and stripe cutting for improved module performance. The TLSTechnology™ has gained importance in contrast to conventional separation techniques due to smooth and defect free cutting edges. This leads to a significant higher module power gain and less module power degradation.

Teile dieser Art werden in der " Huss Maschinenbau GmbH" auf Kundenwunsch auf einer SHW Powerspeed gefertigt. Für mehr Information wenden sie sich bitte an Herrn Aaron Huss. Tel.: 037342/14937 12 Wir beschaffen Brennteile und Material und Schweißen, glühen, strahlen diese Teile . Bearbeiten diese Teile auf einer Fünf-Achs-SHW -Powerspeed bis zu einer Größe von 2100 x 1300 x 8000 mm. Inklusive Vermessungsprotokoll.

Schweißtisch System - Ihr Vorteil: Erweiterungen, Zubehör und Sonderanfertigungen Das modulare Schweißtisch System ermöglicht es, mit wenigen Teilen die vielfältigsten, bedarfsgerechten und wiederholgenauen Tischflächen entstehen zu lassen. Das gesamte Schweißtisch System ist uneingeschränkt erweiterbar. Schienen lassen sich schnell und einfach entfernen, um Bauteile hindurch zu stecken. Auch die Möglichkeit des Austauschens der Schienen gibt dem Anwender Sicherheit im besonders groben Schweißbetrieb.

In der Düsentechnik spielen keramische Werkstoffe aufgrund ihrer exzellenten Eigenschaften, im Hinblick auf Verschleißbeständigkeit, Härte, Zähigkeit und thermische Beständigkeit, eine große Rolle.

Einzelteilfertigung, Schweißen ( MIG / MAG / WIG ), Spannungsarm glühen / Strahlen, Mechanische Fertigbearbeitung

Teile dieser Art werden in der " Huss- Maschinenbau GmbH" auf Kundenwunsch gefertigt. Für mehr Information wenden sie sich bitte an uns. Laserteile und Zuschnitte verschweißt ,Verputzt ,spannungsfrei geglüht und auf CNC-Bearbeitungszentrum bearbeitet. Inklusive Meßprotokoll.

3DMicromac‘s microSHAPE™ laser system is designed for the processing of large and flat substrates with high accuracy. The highly versatile system allows the combination of different laser processes in a single machine. In addition, it is capable of processing with multiple working heads – this parallel processing makes higher throughputs achievable. microSHAPE™ is an industry proven solution for all kinds of ablative and non-ablative processes. These include cutting, selective removal of thin films, and structuring processes like engraving and marking. The microSHAPE™ system is suitable for machining a variety of materials, e.g. glass, metals, polymer, ceramics, display stacks, and coated substrates. Free form cutting with extraordinary quality Damage free cutting edges Contactless processing enables minimal cost of ownership Cutting speed up to 1.5 m/sec Laser sources according to customer requirements Up to 3 independent beam paths

Anwendungen: - Excimer Laser-Lift-Off mittels Line-Beam-Systemen - Laserbohren und Ablation mittels Scannersystemen oder Maskenprojektion - Lasergravur von optischen Materialien Materialien: Polymere, Polymerschichtsysteme, Glaswerkstoffe

3DMicromac‘s laser system microMARK™ RXe has revolutionized the efficiency of blocked lens engraving by using excimer lasers. Equipped with an optimized optical components setup and a large sized magnification ratio, this new generation of RX marking devices offers an increased depth of focus at lowest laser power operation on all materials. Customers benefit from low investment and small operating costs. High quality engraving Accurate contrast adjustment Low investment and operating costs Reliable process stability Smallest excimer system footprint available on the market High quality engraving with accurate contrast adjustment on a variety of spectacle lenses and coatings Smallest required space on the market Low investment and operating costs Easy retrofit of automated handling system at customer’s site on request

3DMicromac‘s microPRO™ is an adaptable laser micromachining system mainly used in industrial production. Its high versatility makes the system perfectly suited for industrial laser micromachining tasks such as laser structuring, cutting, and drilling applications. Furthermore, it is suitable for a variety of materials, e.g., metals, alloys, transparent and biological substrates, ceramics, and thin film compound systems. The microPRO™ is available with an automatic handling system for wafers, cassettes, trays, etc The microPRO™ enables the laser processing of various substrates. Due to the integration of different technology modules, the platform can be adapted to customers’ requirements. Configuration packages may include High speed cutting Drilling Engraving Structuring and modification Laser Lift Off (LLO) Cylindrical machining Customized solutions

vollautomatische Elektrodenkappenwechselgeräte für den Einsatz an Roboterschweißzangen.

The DMP machine solutions are designed for flexible series production of complex metal components using micro laser sintering. The DMP machine series is the perfect solution to achieve superior detail resolution, highest surface quality, unrivalled accuracy, and very high part density. It offers high flexibility, low operating costs and user friendliness. The system includes a zero point clamping system for easy post-processing at the highest accuracy level and inert gas atmosphere including gas purifying based on industry standards. The DMP systems are able to process non-reactive and reactive materials, e.g. stainless steel, molybdenum, tungsten, titanium, and gold. The Micro Laser Sintering technology has been developed and is continuously improved by 3D MicroPrint GmbH. Superior detail resolution Highest surface quality Unrivalled accuracy Very high part density Build volume (L x W x H):60mm x 60mm x 30 mm Build rate:330 mm3/h (typical) Layer thickness:≤ 5 µm Lateral resolution:down to 30 µm Surface Roughness:down to 2 µm (Ra) Laser source:Fiber laser 50 W (optionally 200 W) Precision optics:High speed galvo scanner Spot diameter:< 30 µm

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.

The microVEGA™ xMR system provides high throughput laser annealing for monolithic magnetic sensor formation. A highly flexible tool configuration, the microVEGA™ xMR can accommodate both Giant Magnetoresistance (GMR) and Tunnel Magnetoresistance (TMR) sensors, as well as easily adjust magnetic orientation, sensor position and sensor dimension—making it an ideal solution for magnetic sensor production. The microVEGA™ xMR uses on-the-fly spot and variable laser energy to provide selective heating of the pinning layer in each sensor in order to “imprint” the intended magnetic orientation. Magnetic field strength and orientation is adjustable by recipe, while high temperature gradients ensure low thermal impact. This allows sensors to be processed directly next to readout electronics as well as closer together, and enables the production of smaller sensors—freeing up space for processing more devices per wafer.

The microMARK™ MCF is a premium engraving system. Using an UV excimer laser results in a superior engraving quality considering all cosmetic aspects – without any heat affection and micro cracks. The system is suitable for marking of all kinds of materials and coatings including highindex, tinted, and coated lenses. The microMARK™ MCF is the right choice for concave or convex as well as for blocked and unblocked lenses. The industryapproved system guarantees maximum throughput and availability. Premiumquality excimer laser marking Technical engraving and branding on all kinds of lenses and coatings UDI marking of hard and soft contact lenses Maximum throughput by automatic handling Superior availability by second laser source

Dreh-Schweißtische mit horizontaler Drehfunktion Dreh-Schweißtische eignen sich besonders, um schwere, große Werkstücke präzise zu positionieren. Innovative Technik und bewährte Qualität: Durch den Einbau eines Kugeldrehkranzes kann die Tischfläche um 360° gedreht und beliebig festgestellt werden. Der Drehkranz ist unempfindlich gegenüber Schweißspritzern gelagert und für hohe Axiallasten ausgelegt. Auch eine Teilbelegung der Dreh-Tische ist möglich. Vorteile eines Förster Schweißtischs – mit Drehfunktion Unsere Dreh-Schweißtische bieten die Vorteile eines Förster Schweißtischs, allerdings mit zusätzlicher Drehfunktion. Sie erhalten ein modulares Schweißtisch-System, mit dem Sie alle Spannelemente und Anschläge beliebig positionieren können. Die stabilen Schienen sind einerseits mit einer Grauguss-Oberfläche für die Stahlverarbeitung lieferbar, welche eine Unempfindlichkeit gegenüber Schweißspritzern aufweist. Andererseits bieten wir Schienen mit...

Applications: - Laser cutting, dicing, and filamentation - Laser drilling – available as trepanning or percussion process - Laser micro structuring and ablation, e.g. with FSLA technology - Laser micro engraving, both on the substrate surface and as sub surface engraving in transparent materials Laser-Lift-Off (LLO) using DPSS laser and scanner systems Materials: ceramics, metals, polymers, glass materials, semiconductors, compound material

- Formate von 1/2 bis 1/6-Zellen und Größen bis zu M12 - Freiformschneiden - Leistungssteigerung von bis zu 2W durch TLS-Technologie Die patentierte Lasertechnologie von 3D-Micromac zum direkten Schneiden von Solarzellen ist die führende Methode zum Schneiden von Zellen. Wenn herkömmliche Schneidverfahren an ihre Grenzen stoßen, kommt die TLS-Technologie mit ultrakurzen Pulsen ins Spiel. Exzellente Schnittqualitäten mit hoher Reproduzierbarkeit und Genauigkeit können garantiert werden. Egal ob Halbzelle, Drittelzelle, Viertelzelle oder die zukunftsweisende Sechszelle. Durch die große Flexibilität der TLS-Technologie ist es möglich, unsere Kunden umfassend zu unterstützen. Anpassung in der Anzahl der Zellschnitte, Variation in der Größe der Substrate bis zu 220mm oder eine hohe Flexibilität in der Formfreiheit. Von siliziumbasierten Zelltypen wie PERC, TOPCon, HJT bis IBC ist die Bearbeitung Ihrer mono- und polychristalinischen Photovoltaikzellen möglich.

Ob Siebmaschinen, Biegemaschinen oder Schweißroboter, der Gebrauchtmaschinenhandel der Brand GmbH hat Baumaschinen und Werkzeugmaschinen in vielfältigen Ausführungen. Auf 56.000 Quadratmetern Firmengelände und online auf gebraucht-maschinen-handel findet man voll funktionsfähige gebrauchte Drehmaschinen, Fräsmaschinen und Schleifmaschinen. Auch gebrauchte Erodiermaschinen, Sickenmaschinen und Sandstahlanlagen kann man bei Brand in Riesa günstig kaufen. Zudem gibt es Pressen aller Art, beispielsweise Exzenterpressen, Abkantpressen und Hydraulikpressen. Für besondere Industriezweige hat die Brand GmbH Spezialmaschinen, wie Textilmaschinen und Verpackungsmaschinen im Angebot.

3DMicromac‘s microSTRUCT™ C is a highly flexible laser micromachining system predominantly used in product development and applied research. Superior flexibility makes the system ideally suited for laser structuring, cutting, drilling and welding applications on a variety of substrates, e.g. metals, alloys, transparent and biological material, ceramics and thin film compound systems. The microSTRUCT™ C offers a maximal degree of freedom regarding the positioning of the substrates. Flexible, stable and repeatable machining results Two independent and free configurable working areas with various optical setups Open system concept for the integration of different laser sources High range of software functions (Masterscript) User friendly, flexible, upgradeable system

Applications: - Excimer Laser-Lift-Off using line-beam systems - Laser drilling and ablation using scanner systems or mask projection - Laser engraving of optical materials - Materials: polymers, polymer compounds, glass materials

Layer-by-layer 3D metal printing using lasers as the energy source and metallic wires as the filler material is a process variant of additive manufacturing and 3D printing. With the coaxworks wireM laser welding head, welding wires can be used for manufacturing strategies of massive volumes and thin-walled structures. The application can be suitable for certain components due to fast availability and effective material use already from quantity 1. Wire-based 3D metal printing offers the following potentials compared to previous manufacturing methods: > Near-net-shape parts with the saving of subtractive work when milling from the solid > Near-demand production of small series and prototypes > Energy-saving component production compared to casting or forming Whether the application is also suitable for your tasks or whether the potentials can also be used for your products - we would be happy to discuss both with you. Send us an e-mail!

With the SGC500 portable shielding gas chamber, coaxworks offers a separate machinery component for CNC and robot-based laser wire welding processes. By means of a flexible foil tent and an additional adapter on the laser welding head, a high-purity shielding gas atmosphere can be set up. Bottom connections for a continuous flow of inert argon gas allow a stable oxygen content of less than 20 ppm after only 20 minutes. The SGC500 protective gas chamber has the following integrated technical features: > a handling flap on the front side for quick chamber loading when the foil tent is installed, > two glove ports at the front for component handling when the chamber is flooded, > a removable T-slot plate for defined clamping of components, > three viewing windows for process observation from the outside and > a quick-clamping system on the top for defined fastening of the foil tent. Special designs can be customised. Send us your specific request by e-mail! Dimensions:610 x 610 x 269 mm³ (height x width x depth, without foil tent and gloves) Suitable processible component size:~150 x 150 x 150 mm³ (height x width x depth) Weight:~25kg (without foil tent and gloves) Protective gas connections:4x Ø8 mm hose connection Glove connections:2x Ø144 mm Possible connections for other media:12x screw plug G1/4

3DMicromac‘s microMARK™ MCL is a compact and maintenance free DPSS laser system to meet customer’s demand for high quality laser engraving with significantly decreased cost of ownership. The system is utilized for visible, invisible as well as for technical engravings of all kind of spectacle lenses as well as marking of hard and soft contact lenses. The use of a UV DPSS laser source achieves a high quality marking result comparable to excimer laser engravings. High quality laser engraving Accurate contrast adjustment Low investment and operating costs Maintenance free laser source Plug-and-play replacement of main components directly by the customer High quality engraving with accurate contrast adjustment on a variety of spectacle lenses and coatings

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.

Biegeteile und andere Komponenten zu kompletten Baugruppen. Mit unseren Schweißzertifikaten nach DIN15085-2 CL1 für Schienenfahrzeuge, nach EN1090-2/-3 EXC3 für tragende Konstruktionen und nach AD 2000 HP0 für Druckgeräte erfüllen wir auch Ihre anspruchsvollen Anforderungen.

The coaxworks wireM laser welding head opens up new possibilities for surface repair and geometry modification of tools in metalworking. Areas of application are, for example, tools for sheet metal and solid forming, wear parts of construction machines or other functional components subject to abrasive stress. With the installation in a CNC machine or a robot laser system, the fully mechanical processing of simple surfaces up to complex three-dimensional tool surfaces is possible. We would be happy to advise you on how the full potential of surface repair can also be used for your workpieces. Send us an e-mail!

3DMicromac’s microMIRA™ LLO system provides highly uniform, force free lift off of different layers on wafers at high processing speed. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements. The laser system can be used for a variety of applications, such as GaN lift off from glass and sapphire substrates in microLED display manufacturing as well as in semiconductor manufacturing. Additional applications include laser annealing and crystallization for surface modification. Force free and extremely fast line beam laser processing No damage due to thermo-mechanical effects Low production costs Elimination of costly and polluting wet chemical processes Integration of adjacent manufacturing steps for higher fab productivity

By using our coaxial laser welding head wireM, the welding process can be carried out independently of the direction, so that the coatings can be applied not only to rotationally symmetrical but also to flat and freely formed component surfaces. By selecting the wire filler material according to the requirements, the achievable coating properties can be adapted to the desired requirements. Characteristic features: > A low energy input causes a flat penetration by mixing the welding wire only minimally with the component material. > Complete utilisation of the filler wire results in particularly clean process conditions for human and machine. > By selecting the laser power and the wire diameter, the layer thickness can be varied and thus only as much material as necessary can be applied in a cost-efficient manner. > The use of the SGC500 shielding gas chamber for welding in an inert, oxygen-free process atmosphere makes it possible, for example titanium and iron materials.

The microPREP™ PRO system was developed to provide efficient laser sample preparation fitted to the needs of microstructure diagnostics and failure diagnostics. Therefore, with microPREP™ PRO material samples can be prepared effectively and economically by using an ultrashort pulse laser. microPREP™ PRO allows to create complex and 3D-shaped samples to enable more comprehensive analysis of certain structures like in advanced packages, such as through silicon vias (TSVs), or even complete systemsinpackage (SiP). Furthermore, it is ideal to provide larger sized samples with microlevel precision. The integrated overview camera assists in navigating on larger samples – the high definition process camera allows for exact positioning. Moreover, the application of a picosecond laser ensures virtually no structural damage and no elemental contamination of the material.